Evonik Degussa Silanes - EM Papers & Publications
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Electronic Materials Papers and Publications.

For more information regarding any of the papers posted below, please contact us:

  • "New Slurries for ILD and STI CMP", M. Kröll, R. Brandes, Degussa GmbH, Hanau, Germany, CMP-MIC, Fremont, February 2007

  • "Pyrogenic Metal Oxides for Use in Future CMP Applications", M. Kröll, Degussa AG, Hanau, Germany, CAMP Meeting, Lake PLacid, USA, August 2006

  • "Einsatz von nanoskaligem Ceroxid zur Optimierung von Glas- und Halbleiteroberflächen", M. Kröll, Degussa GmbH, SEPAWA Meeting, Essen, März 2006

  • "Pyrogenic Metal Oxides for Use in Future CMP Applications", M. Kröll, Degussa AG, Hanau, Germany, CMP-MIC, Fremont, USA, February 2006

  • "Influences on the polishing results in STI and ILD CMP using nanostructured fumed Ceria", M. Kröll1, R. Brandes2, W. Lortz1, E. Stachowiak3, G. Zwicker3, 1Degussa AG, Rodenbacher Chaussee 4, 63457 Hanau, Germany, 2Degussa Corp., 379 Interpace Parkway, P.O. Box 677, Parsippany, NJ 07054-0677, USA, 3Fraunhofer Institute ISIT, Faunhoferstr. 1, 25524 Itzehoe, Germany, PAC-RIM Conference, Seoul, Korea, November 2005

  • "Fumed Ceria for Use in STI and ILD CMP" by Michael Kröll, Ralph Brandes, Wolfgang Lortz, Degussa AG, Hanau, Germany and Eric Stachowiak, Michael Torkler, Gerfried Zwicker, Faunhofer Institute ISIT, Itzehoe, Germany, CAMP Meeting, Lake Placid, USA, August 2005

  • "Fumed Ceria for Use in STI and ILD CMP" by Michael Kröll, Ralph Brandes, Wolfgang Lortz, Degussa AG, Hanau, Germany and Eric Stachowiak, Michael Torkler, Gerfried Zwicker, Faunhofer Institute ISIT, Itzehoe, Germany, CMP User Meeting München, April 2005

  • "Fumed Ceria for use in ILD and STI CMP" by M. Kröll 1, R. Brandes 2, W. Lortz 1, A. Philipossian 3, 1 Degussa AG, Rodenbacher Chaussee 4, 63457 Hanau, Germany: 2 Degussa Corp., 2 Turner Place, Piscataway, NJ 08855, USA: 3 University of Arizona, Department of Chemical and Environmental Engineering, Tucson, AZ, USA: February 2005

  • "Metrological Assessment of the Coefficient of Friction of Various Types of Silica Using the Motor Current During ILD-CMP" by H. Jacobsen, E. Stachowiak, G. Zwicker, FRAUNHOFER INST.; Itzehoe, GERMANY, W. Lortz; DEGUSSA AG, Hanau, GERMANY and R. Brandes, DEGUSSA CORP., Piscataway (NJ), USA; Material Research Society Meeting, San Francisco (CA), April 2004

  • "Investigations on Novel Modified Fumed Abrasives from the System SiO2 and Al2O3 for Cu CMP applications" by D. Zeidler and J.W. Bartha; TU DRESDEN, Dresden Germany, W. Lortz; DEGUSSA AG, Hanau, GERMANY and R. Brandes, DEGUSSA CORP.; Piscataway (NJ), USA; Material Research Society Meeting, San Francisco (CA), April 2004

  • "Characterization of Oxide CMP Slurries With Fumed Silica Abrasive Particles Modified by Wet Jet Milling" by G. Zwicker, H. Jacobsen and E. Stachowiak; FRAUNHOFER INST.; Itzehoe, GERMANY; W. Lortz, DEGUSSA; Hanau, GERMANY and R. Brandes; DEGUSSA CORP.; Piscataway (NJ), USA. International Conference for ULSI Multilevel Interconnection (CMP-MIC), Marina del Rey (CA), February 2004

  • "News from the "M" in CMP" by W. Lortz and F. Menzel; DEGUSSA AG; Hanau, GERMANY; R. Brandes, T. Knothe, F. Klaessig; DEGUSSA CORP.; Piscataway, N.J.; and T. Shibasaki, Nippon Aerosil, JAPAN; Material Research Society Meeting, San Francisco (CA), April 2003

  • "Metal-Doped Silica Abrasive Slurries and Their Effect on Friction and Removal Rate Characteristics of ILD and STI CMP" by R. Brandes, T. Knothe, F. Klaessig; DEGUSSA CORP.; Piscataway, NJ; and F. Menzel, W. Lortz and G. Varga; DEGUSSA AG; Hanau, GERMANY; T. Shibasaki, Nippon Aerosil, Tokyo, JAPAN and A. Philipossian; UNIV. of ARIZONA; Tucson, AZ., International Conference for ULSI Multilevel Interconnection (CMP-MIC), Marina del Rey (CA), February 2003 and German CMP User Meeting at Semicon Europa, Munich, Germany, April 2003

  • "New Particles for CMP Application by Changing the Powder Morphology of Fumed Silica" by R. Brandes, T. Knothe, F. Klaessig; DEGUSSA CORP.; Piscataway, NJ; and F. Menzel, W. Lortz and G. Varga; DEGUSSA AG; Hanau, GERMANY; and T. Shibasaki, Nippon Aerosil, Tokyo, JAPAN, A. Philipossian; UNIV. of ARIZONA; Tucson, AZ. and G. Zwicker, Fraunhofer Institut, Itzehoe, GERMANY, Meeting of Japanese Society for Precision Engineering at Semicon West, San Francisco (CA) July 2002 and CAMP Meeting, Lake Placid (NY), August 2002

  • "Neues vom CMP, oder welche Teilchen polieren denn da" by W. Lortz, DEGUSSA AG, Hanau, GERMANY, Deutsches CMP Nutzertreffen, Frankfurt (Oder), Oktober 2001

  • "Process and Application of Fumed Silica AEROSIL®" by T. Shibasaki, Nippon Aerosil, Tokyo, JAPAN and A. Gutsch, DEGUSSA AG; Hanau, GERMANY, CAMP Meeting, Lake Placid (NY), August 1998

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