Chemical-Mechanical Planarization (CMP)

• Chemical-Mechanical Planarization (CMP) is an enabling technology in the fabrication of integrated circuits. Evonik is dedicated to being the preferred global partner for developing innovative semiconductor-industry solutions for CMP.

Global, Electronics-Grade Manufacturing

• Evonik is the world largest supplier of Fumed Metal Oxide particles, with a proven track record in supplying the semiconductor industry abrasive particles for CMP. With electronic-grade manufacturing available in all the industry growth markets, Evonik has the local resources available to develop the particle solutions you require.

Whether your objective is to:

• improve process yield and efficiency in an existing application, or
• if you are targeting slurry development for the next-generation metal CMP or node size,

Evonik has the capabilities and experience necessary to supply AEROSIL^® products that satisfy the stringent requirements of semiconductor applications.

New Product Development

• Evonik AEROSIL^® and Silanes has the broadest pipeline of developmental nanoparticle products available. A range of developmental fumed metal oxides, doped metal oxides, and surface-treated metal oxides are available to assist our clients to keep pace with the International Technology Roadmap for Semiconductors (ITRS). These developmental products are primarily available in powder form, and may also be available as laboratory dispersions for testing purposes.

Evonik as a Partner

• Contact us today to discover how partnering with over 70 years of nanoparticle expertise can benefit you.